advance product information january 5, 2005 1 triquint semiconductor texas phone: (972)994 8465 fax: (972)994 8504 web: www.triquint.com info: info-mmw@tqs.com ku band 2 watt packaged amplifier TGA2904-EPU-FL key features and performance ? frequency range: 13-17 ghz ? optimized for vsat band (13.75-14.5 ghz) ? 33 db nominal gain ? typical > 33.5 dbm psat in vsat band @ 7v ? bias 5-8 v @ 680 ma (quiescent) ?0.5- m m phemt 3mi technology ? 10 lead flange packaged ? package dimensions: 0.7x 0.3 x 0.1 in 3 preliminary measured performance bias conditions: vd = 7 v, idq = 680 ma primary applications ?vsat ? point to point 25 26 27 28 29 30 31 32 33 34 35 12 13 14 15 16 17 18 frequency (ghz) psat (dbm) vd=8v 7v 6v 5v 10 15 20 25 30 35 40 11 12 13 14 15 16 17 18 19 frequency (ghz) gain (db) -30 -20 -10 0 10 20 30 return loss (db) gain input output note: this device is early in the characterization process prior to finalizing all electrical specifications. specifications ar e subject to change without notice. product description the triquint tga2904-fl is a compact 2 watt high power amplifier packaged mmic for ku-band applications. the packaged part provides 33 db nominal gain. the part is ideally suited for low cost emerging markets such as base station transmitters for satellite ground terminals and point to point radio. the tga2904-fl is 100% rf tested to ensure performance compliance. lead-free & rohs compliant. evaluation boards are available.
advance product information january 5, 2005 2 triquint semiconductor texas phone: (972)994 8465 fax: (972)994 8504 web: www.triquint.com info: info-mmw@tqs.com tga2904-epu table i maximum ratings 1/ symbol parameter value notes vd drain supply voltage 8 v 2 / vg gate supply voltage range -5v to 0v idq drain supply current (quiescent) 1.3 a 2 / | ig | gate current 18 ma p in input continuous wave power 21 dbm 2 / p d power dissipation 5 w + (85 c- t b )/13 2 / 3 / t ch operating channel temperature 150 0 c 4 / 5 / t m mounting temperature (30 seconds) 260 0 c t stg storage temperature -65 to 150 0 c 1 / these ratings represent the maximum operable values for this device. 2 / combinations of supply voltage, supply current, input power, and output power shall not exceed p d . 3 / t b = package backside temperature in degrees c. 4 / these ratings apply to each individual fet. 5 / junction operating temperature will directly affect the device median time to failure (t m ). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. table ii rf characterization table (t a = 25 q c, nominal) (vd = 7 v, idq = 680 ma) symbol parameter test condition typical units gain small signal gain f = 13 C17 ghz 33 db irl input return loss f = 13 C17 ghz 10 db orl output return loss f = 13 C17 ghz 10 db pwr output power @ pin = +5 dbm f = 13 C15 ghz 34 dbm
advance product information january 5, 2005 3 triquint semiconductor texas phone: (972)994 8465 fax: (972)994 8504 web: www.triquint.com info: info-mmw@tqs.com tga2904-epu typical fixtured performance bias conditions: vd = 7 v, idq = 680 ma 25 26 27 28 29 30 31 32 33 34 35 12 13 14 15 16 17 18 frequency (ghz) psat (dbm) vd = 8v 7v 6v 5v 10 15 20 25 30 35 40 11 12 13 14 15 16 17 18 19 frequency (ghz) gain (db) -30 -20 -10 0 10 20 30 return loss (db) gain input output
advance product information january 5, 2005 4 triquint semiconductor texas phone: (972)994 8465 fax: (972)994 8504 web: www.triquint.com info: info-mmw@tqs.com tga2904-epu typical fixtured performance bias conditions: vd = 7 v, idq = 680 ma, f = 14 ghz 17 19 21 23 25 27 29 31 33 35 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 input power (dbm) output power (dbm) 600 800 1000 1200 1400 1600 1800 2000 2200 2400 id (ma) pout i d
advance product information january 5, 2005 5 triquint semiconductor texas phone: (972)994 8465 fax: (972)994 8504 web: www.triquint.com info: info-mmw@tqs.com mechanical drawing tga2904-epu units: inches tolerance (unless otherwise noted): +/- 0.005
advance product information january 5, 2005 6 triquint semiconductor texas phone: (972)994 8465 fax: (972)994 8504 web: www.triquint.com info: info-mmw@tqs.com tga2904-epu package assembly diagram vd vd 1 uf 0.01 uf 1 uf 0.01 uf 0.01 uf 1 uf 10 ohm 10 ohm 0.01 uf 1 uf vg vg
advance product information january 5, 2005 7 triquint semiconductor texas phone: (972)994 8465 fax: (972)994 8504 web: www.triquint.com info: info-mmw@tqs.com assembly of a tga2904-epu surface mount package onto a motherboard manual assembly for prototypes 1. clean the motherboard or the similar module with acetone. rinse with alcohol and di water. allow the circuit to fully dry. 2. to improve the thermal and rf performance, we recommend a heat sink attach to the bottom of the package and apply indium alloy sn63 solder or tin lead solder to the bottom of tga2904 3. apply tin lead solder to each pin of tga2904. 4 clean the assembly with alcohol. high volume assembly of the package the tga2904-epu is a custom leaded packaged component. high volume assembly can be performed using standard assembly processes including solder printing such as stencil solder printing. pick-and-place using a standard machine such as a mrsi machine, and solder reflow using a sikama reflow system using typical zone temperatures: 120, 175, 195, and 215 degrees celsuis at 15 second intervals. ordering information part package style tga2904-fl flange (leads bolted down) gaas mmic devices are susceptible to damage from electrostatic discharge. proper precautions should be observed during handling, assembly and test. tga2904-epu
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